News
10.06. - 11.06.2026
Coiltech ® North America Novi (Detroit) 2026 – a resounding success!
Our trade show presentation focused on our latest developments in punching and bonding technology. Our innovative BondTech ® system and the new adhesive device, which enables the precise, efficient, and reliable production of sheet metal sample packages, generated particularly strong interest.
The personal exchanges at the trade show once again demonstrated how important innovative manufacturing technologies and close collaboration are for the industry’s continued development. We would like to extend our sincere thanks to all visitors for their keen interest, the engaging discussions, and the trust they have placed in us.
We look forward to further expanding the contacts we’ve made and actively shaping the future of punching and bonding technology together with our customers.
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NEW - Adhesive device for sample stacks
Precise adhesive application for prototype parts and small production runs.
11.05.2026
Upgrade – We’re Growing!
We welcome our newest team member, a design engineer, who will support and expand our design engineering capacity. With this move, BAUER is taking proactive steps in lean engineering to meet the growing demands of e-mobility and keep pace with new developments.
25.03. - 26.03.2026
Coiltech ® Germany Augsburg 2026 – a resounding success!
Once again this year, we had the opportunity to showcase our latest technologies and innovations at Coiltech ® Augsburg. Thank you very much for visiting us and for the positive feedback on our cutting-edge technology and advanced developments.
