BAUER BondTech ® Adhesive Bonding
The BAUER BondTech® system is designed for the precise application of adhesive drops onto electrical steel laminations. Even at minimal distances to each other, numerous adhesive drops can be applied simultaneously and reliably onto a lamination strip.
Custom-designed dispensing heads enable precise adhesive application to a wide variety of component geometries and requirements. The compact design also allows for easy integration into existing production lines or even the integration in the tool die itself.
Thanks to the standardized Harting connection system, functions can be flexibly integrated, linked, and expanded. This allows the system to be individually adapted to different production requirements.
The Siemens HMI ensures precise control and real-time adaption of all process parameters. All relevant processes can be specifically monitored and adjusted.
The BAUER BondTech® adhesive bonding system combines precision, flexibility, and high process stability in a well-designed complete turn-key for modern manufacturing requirements.
The key features are
- Off-the-shelf technology
- Flexible, universal base system for series and prototype production
- Integration of the application unit in front of or inside the stamping die
- Up to 100 adhesive dots per lamination possible
- Minimum adhesive dot spacing of just 5 mm
- Up to 8 products can be manufactured simultaneously
- Process speeds of up to 500 strokes/min achievable
- Retrofit to existing punching tools possible
We manufacture and distribute BAUER BondTech® equipment to all electrical steel processors. From integration and installation through to day-to-day operation, we support you with our technical expertise to ensure that your production runs reliably and smoothly.
We would be happy to demonstrate the BAUER BondTech® process to you at our facility.
Do you have any questions or would you like to receive a quote? If so, please contact us.