Products
In addition to our range of services, we develop our own products that facilitate and complement the die-cutting and packaging process.
BAUER BondTech ® Adhesive packaging system
The BAUER BondTech® adhesive packaging system is a precision dispensing station designed for the accurate application of adhesive dots. Learn more about our unique adhesive technology, which is freely available on the market.
Cleaningstation
An automated cleaning station for all BAUER dosing heads. This system cleans the dosing heads safely and gently.
A testing function ensures error-free adhesive application in your production process.
Adhesive device for sample stacks
For sampling sheet metal stacks, we recommend our adhesive and press-fit device. Adhesive dots are applied to individual laminations using a custom dispensing head and then pressed together.
Even in the early stages of rotor and stator development, you can use this bonding device and the cost-effectively manufactured sample stacks to optimize your component geometry through tensile, bending, or roll peeling tests.
